FR4 TG170 RIGID-FLEX PCB

Product parameters

Layer: 8
Board Thickness(mm): 2.0
Copper Thickness(oz): 1
Surface Treatment:  LF HAL
Solder Mask: TOP Green BOT Green
Silk Screen: TOP White BOT White
Test: Flying
Min Width(mil): 5
Min Spacing（mil): 3.6
Min Hole Diameter(mm): 0.2
Aspect Ratio: 10
TG: 170

Application Fields:

Widely used in communication, security, medical, industrial control, consumer electronics filed and so on.