8 Layer Rigid-flex PCB

Product parameters

Layer: 8
Board Thickness(mm): 2.4
Copper Thickness(oz): 5
Surface Treatment: Immersion gold au=1u''
Solder Mask: TOP Black BOT Black
Silk Screen: TOP White BOT White
Test: Flying
Min Width(mil): 4.5
Min Spacing（mil): 6.7
Min Hole Diameter(mm): 0.2
Aspect Ratio: 12


Application Fields:

Widely used in communication, security, medical, industrial control, consumer electronics filed and so on.