2 Layer Rigid-flex FR4 Board

Product parameters

Layer: 2
Board Thickness(mm): 1.6
Copper Thickness(oz): 1
Surface Treatment: Immersion Gold au=1u''
Solder Mask: TOP Green BOT Green
Silk Screen: TOP White BOT White
Test: Flying
Min Width(mil): 5.2
Min Spacing（mil): 7.7
Min Hole Diameter(mm): 0.2
Aspect Ratio: 8
TG: 170

Application Fields:

Widely used in communication, security, medical, industrial control, consumer electronics filed and so on.