High Frequency Wirelesss Headset PCB

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Product parametersLayer: 6Board Thickness(mm): 2.4Copper Thickness(oz): 1Surface Treatment: Immersion gold au=1u''Solder Mask: TOP Green BOT GreenSilk Screen: TOP White BOT WhiteTest: FlyingMin Width(mil): 4.4Min Spacing（mil): 5.5Min Hole Diameter(mm): 0.2

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Product Description

Product parameters

Layer: 6
Board Thickness(mm): 2.4
Copper Thickness(oz): 1
Surface Treatment: Immersion gold au=1u''
Solder Mask: TOP Green BOT Green
Silk Screen: TOP White BOT White
Test: Flying
Min Width(mil): 4.4
Min Spacing（mil): 5.5
Min Hole Diameter(mm): 0.2
Aspect Ratio: 12

Application Fields:

Used in Wirelesss Heaqdset and so on.

4 Layer BGA Bold Color PCB

4 Layer High Frequency Pcb

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